Mobile Technology Set 2
Free Online Best Mobile Technology MCQ Questions for improve your basic knowledge of Mobile Technology. This Mobile Technology Set 2 test that contains 25 Multiple Choice Questions with 4 options. You have to select the right answer to a question.
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Question 1 |
What is to assemble?
A | Assemble is to fit together all the separate pieces in order to form one whole |
B | Assemble is to take something apart or to break it down into pieces |
C | Both a & b |
D | None of the above |
Question 2 |
Steps that take when a mobile phone is assembling ______
A | Fix the vibrator strips of speaker and volume button,Fix the motherboard,Connect the antenna with wire |
B | Place the camera and connect it,Place the buzzer,Put the camera cover |
C | Make sure that the LCD is working before you place the screencover,Put battery and battery cover |
D | All of the above |
Question 3 |
What is Soldering?
A | Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint |
B | Soldering is the removal of solder and components from a printed circuit board for troubleshooting, repair, replacement, and salvage |
C | Soldering is a process to Use a solder wick (finely braided copper) to wick away excess solder from a de-soldered connection |
D | Soldering is a process to Continue heating and apply a few millimeters of solder Remove the iron and allow the solder joint to cool naturally |
Question 4 |
What is Desoldering ?
A | Desoldering is the removal of solder and components from a printed circuit board for troubleshooting, repair, replacement, and salvage |
B | Desoldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint |
C | Desoldering is a process to Use a solder wick (finely braided copper) to wick away excess solder from a de-soldered connection |
D | Desoldering is a process to Continue heating and apply a few millimeters of solder Remove the iron and allow the solder joint to cool naturally |
Question 5 |
Jumper wires can mainly be of_____types
A | two |
B | three |
C | four |
D | five |
Question 6 |
What is a fault?
A | A fault is temporarily complete a circuit |
B | A fault is a defect (a failure in a circuit) or an electronic device |
C | A fault is destroyed a circuit |
D | A fault is permanent failure a circuit |
Question 7 |
Jumper wires are_____
A | insulated and non-insulated |
B | Soldering ,Desoldering |
C | Availability,Suitability |
D | All of the Above |
Question 8 |
Mobile phone faults____
A | Settings faults |
B | Hardware faults |
C | Software faults |
D | All of the above |
Question 9 |
Which of the following is not an OS for mobile?
A | Palm |
B | Windows |
C | Mango |
D | Android |
Question 10 |
DDoS in mobile systems wait for the owner of the _____________ to trigger the attack.
A | worms |
B | virus |
C | botnets |
D | programs |
Question 11 |
What causes faults or failures in mobile phones? Failures can be caused by any of the following:
A | excess temperature, excess current or voltage, ionizing radiation, |
B | mechanical shock, stress or impact, contamination, |
C | short circuits, imperfect connections, poor insulation or wiring caused by grounding |
D | All of the above |
Question 12 |
SIM Card section is______
A | Interface section is directly connected with the CPU in most mobile cell phones |
B | LCD Backlight in mobile cell phones is made according to the series circuit. A Boost Voltage Generator section is built for the supply of high voltage (10 to 18V) for the functioning of the LCD LED. Boost coil, Boost Volt Driver IC, Rectifier Diode are present in this section |
C | LED Lights are connected according to the parallel circuit in the key backlight section. Anode ends of all the LEDS are connected to each other and all the cathode ends to each other |
D | All of the above |
Question 13 |
Skills Needed to Diagnose and Repair a Mobile Phone____
A | Soldering ,Desoldering |
B | Testing using a multimeter |
C | Jumper setting |
D | All of the above |
Question 14 |
Steps In Soldering______
A | Prepare theSoldering Iron, Solder paste,Long Nose Pliers,PCB holder,Electronic Components |
B | Plug and pre-heat the soldering iron,Heat both items at the same time by applying the soldering iron to the copper pad and the component lead |
C | Continue heating and apply a few millimeters of solder Remove the iron and allow the solder joint to cool naturally |
D | It only takes a second or two to make the perfect joint, which should appear shiny |
Question 15 |
Jumpering means___
A | to complete a circuit |
B | to heat and apply a few millimeters of solder Remove the iron and allow the solder joint to cool naturally |
C | to temporarily complete a circuit or to bypass a break in a circuit by making a connection from one point to another |
D | All of the Above |
Question 16 |
There are _____types of mobile phone faults
A | two |
B | three |
C | four |
D | five |
Question 17 |
A_______wire is used to make a jumper which by-passes the components
A | Bad conductor |
B | Good conductor |
C | both a and b |
D | None of Above |
Question 18 |
LCD Backlight Section is_______
A | LCD Backlight in mobile cell phones is made according to the series circuit. A Boost Voltage Generator section is built for the supply of high voltage (10 to 18V) for the functioning of the LCD LED. Boost coil, Boost Volt Driver IC, Rectifier Diode are present in this section |
B | Interface section is directly connected with the CPU in most mobile cell phones |
C | LED Lights are connected according to the parallel circuit in the key backlight section. Anode ends of all the LEDS are connected to each other and all the cathode ends to each other |
D | None of Above |
Question 19 |
There are_____ methods that you can use to find out faulty or damaged components in a mobile phone.
A | two |
B | three |
C | four |
D | five |
Question 20 |
Internal Parts of a Mobile Phone
A | SIM card section,Memory card section |
B | Ear Speaker Section,Speaker/Ringer Section,Key Backlight Section,LCD Backlight Section |
C | Vibrator Motor Section,Network Section,Battery Charging Section,FM Radio Section,Bluetooth Section,Hands free (Earphone) Section |
D | All of the above |
Question 21 |
Steps to disassembe a mobile phone_____
A | Switch off the phone ,Remove the battery cover Remove the battery, SIM card memory card (if any) |
B | Remove all the screws from the phone,Lift back the cover with the help of a flat screwdriver,Remove the strips (buzzer strip, display, camera, volume and speaker button strips) |
C | Remove the antennae wire from the outside 8.Remove the motherboard and vibrator |
D | All of the above |
Question 22 |
Hardware faults_____
A | occur due to problems with software |
B | occur due to hardware malfunctioning |
C | occur due to wrong/invalid settings |
D | All of the above |
Question 23 |
methods that you can use to find out faulty or damaged components in a mobile phone.
A | The cold testing method ,The hot testing method |
B | Soldering ,Desoldering |
C | insulated and non-insulated |
D | All of the Above |
Question 24 |
Backlight Section is ___
A | LED Lights are connected according to the parallel circuit in the key backlight section. Anode ends of all the LEDS are connected to each other and all the cathode ends to each other |
B | LCD Backlight in mobile cell phones is made according to the series circuit. A Boost Voltage Generator section is built for the supply of high voltage (10 to 18V) for the functioning of the LCD LED. Boost coil, Boost Volt Driver IC, Rectifier Diode are present in this section |
C | Interface section is directly connected with the CPU in most mobile cell phones |
D | All of the above |
Question 25 |
Steps in desoldering____
A | Use a solder wick (finely braided copper) to wick away excess solder from a de-soldered connection |
B | Apply the solder wick and use the soldering iron to the de-soldered connection. the solder wick will draw the excess solder off the PCB pad |
C | both a and b |
D | None of Above |
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